Invention Grant
- Patent Title: Method for measuring a property of interconnections and structure for the same
- Patent Title (中): 用于测量相互连接和结构的性质的方法
-
Application No.: US11849836Application Date: 2007-09-04
-
Publication No.: US07646207B2Publication Date: 2010-01-12
- Inventor: Jian-Hong Lin , Chin Chuan Peng , Shou-Chung Lee , Chien-Jung Wang , Chien Shih Tsai , Bi-Ling Lin , Yi-Lung Cheng
- Applicant: Jian-Hong Lin , Chin Chuan Peng , Shou-Chung Lee , Chien-Jung Wang , Chien Shih Tsai , Bi-Ling Lin , Yi-Lung Cheng
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Thomas, Kayden, Horstemeyer & Risley
- Main IPC: G01R27/08
- IPC: G01R27/08
Abstract:
A method for measuring a property of interconnections is provided. The method includes the following steps. A plurality of interconnection test patterns are provided. A pad to which the plurality of interconnection test patterns are parallelly connected is formed. At least one resistor is formed between at least one of the plurality of interconnection test patterns and the pad. The property of the plurality of interconnection test patterns is measured by applying a current, a voltage and/or a mechanical stress to the pad.
Public/Granted literature
- US20090058434A1 METHOD FOR MEASURING A PROPERTY OF INTERCONNECTIONS AND STRUCTURE FOR THE SAME Public/Granted day:2009-03-05
Information query
