Invention Grant
- Patent Title: Integrated circuit package system with package substrate having corner contacts
- Patent Title (中): 集成电路封装系统，封装基板具有角接点
-
Application No.: US11941409Application Date: 2007-11-16
-
Publication No.: US07646105B2Publication Date: 2010-01-12
- Inventor: Seng Guan Chow , Tae Hoan Jang
- Applicant: Seng Guan Chow , Tae Hoan Jang
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L23/02 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/76 ; H01L21/301 ; H01L21/46 ; H01L21/78
Abstract:
A integrated circuit package system includes: forming a package substrate with a top substrate side and a bottom substrate side; forming a corner contact in a first corner of the bottom substrate side, the corner contact extending to a substrate edge of the package substrate; mounting an integrated circuit device over the top substrate side; connecting an electrical interconnect between the integrated circuit device and the top substrate side; and forming a package encapsulation over the top substrate side, the integrated circuit device, and the electrical interconnect.
Public/Granted literature
- US20090127719A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE SUBSTRATE HAVING CORNER CONTACTS Public/Granted day:2009-05-21
Information query
IPC分类:
