Invention Grant
US07646098B2 Multilayered circuitized substrate with p-aramid dielectric layers and method of making same
失效
具有对芳族聚酰胺介电层的多层电路基板及其制造方法
- Patent Title: Multilayered circuitized substrate with p-aramid dielectric layers and method of making same
- Patent Title (中): 具有对芳族聚酰胺介电层的多层电路基板及其制造方法
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Application No.: US12081042Application Date: 2008-04-10
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Publication No.: US07646098B2Publication Date: 2010-01-12
- Inventor: Robert M. Japp , Voya R. Markovich , Kostas I. Papathomas , Mark D. Poliks
- Applicant: Robert M. Japp , Voya R. Markovich , Kostas I. Papathomas , Mark D. Poliks
- Applicant Address: US NY Endicott
- Assignee: Endicott Interconnect Technologies, Inc.
- Current Assignee: Endicott Interconnect Technologies, Inc.
- Current Assignee Address: US NY Endicott
- Agency: Hinman, Howard & Kattell
- Agent Mark Levy
- Main IPC: H01L23/485
- IPC: H01L23/485
Abstract:
A multilayered circuitized substrate including a plurality of dielectric layers each comprised of a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin including an inorganic filler but not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on a first of the dielectric layers. A method of making this substrate is also provided.
Public/Granted literature
- US20080191353A1 Multilayered circuitized substrate with p-aramid dielectric layers and method of making same Public/Granted day:2008-08-14
Information query
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