Invention Grant
- Patent Title: Semiconductor package, method for manufacturing a semiconductor package, an electronic device, method for manufacturing an electronic device
- Patent Title (中): 半导体封装，半导体封装的制造方法，电子器件，电子器件的制造方法
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Application No.: US12121508Application Date: 2008-05-15
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Publication No.: US07646089B2Publication Date: 2010-01-12
- Inventor: Futoshi Fukaya , Yuichi Asano , Yoshinori Niwa
- Applicant: Futoshi Fukaya , Yuichi Asano , Yoshinori Niwa
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Main IPC: H01L23/22
- IPC: H01L23/22 ; H01L23/24 ; H01L23/14 ; H01L23/29
Abstract:
A semiconductor package including a substrate with a semiconductor device mounted on the substrate and a resin member sealing the substrate and semiconductor device. The resin member includes a first surface and a second surface located on the other side of the first surface and a plurality of leads electrically connected with the semiconductor device. The leads project from the resin member and extend to the second surface side; wherein the second surface of the resin member includes a first area having a first concave portion and a second area having a second concave portion which is different from the first area, and the second concave portion is deeper than the first concave portion.
Public/Granted literature
Information query
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