Invention Grant
US07646088B2 Adhesive sheet for light-emitting diode device and light-emitting diode device
有权
发光二极管器件和发光二极管器件用粘合片
- Patent Title: Adhesive sheet for light-emitting diode device and light-emitting diode device
- Patent Title (中): 发光二极管器件和发光二极管器件用粘合片
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Application No.: US10597349Application Date: 2005-01-13
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Publication No.: US07646088B2Publication Date: 2010-01-12
- Inventor: Koji Itoh , Shigeyoshi Ishii
- Applicant: Koji Itoh , Shigeyoshi Ishii
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Dean M. Harts; Yen Tong Florczak
- Priority: JP2004-025723 20040202
- International Application: PCT/US2005/001269 WO 20050113
- International Announcement: WO2005/076376 WO 20050818
- Main IPC: H01L21/44
- IPC: H01L21/44

Abstract:
[Problem] To provide an adhesive sheet which is used for a light-emitting diode device, and which is free from cracks and peeling off of the adhered portions. [Means for Solving the Problem] An adhesive sheet for a light-emitting diode device, which comprises a thermoplastic polymer containing epoxy groups and a compound containing functional groups which are addition reactive with the epoxy groups or a polymerization catalyst which can effect a ring opening polymerization of the epoxy groups, and in which said thermoplastic polymer is cross-linked so that its flowability is restrained.
Public/Granted literature
- US20080237617A1 Adhesive Sheet for Light-Emitting Diode Device and Light-Emitting Diode Device Public/Granted day:2008-10-02
Information query
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