Invention Grant
US07646088B2 Adhesive sheet for light-emitting diode device and light-emitting diode device 有权
发光二极管器件和发光二极管器件用粘合片

  • Patent Title: Adhesive sheet for light-emitting diode device and light-emitting diode device
  • Patent Title (中): 发光二极管器件和发光二极管器件用粘合片
  • Application No.: US10597349
    Application Date: 2005-01-13
  • Publication No.: US07646088B2
    Publication Date: 2010-01-12
  • Inventor: Koji ItohShigeyoshi Ishii
  • Applicant: Koji ItohShigeyoshi Ishii
  • Applicant Address: US MN St. Paul
  • Assignee: 3M Innovative Properties Company
  • Current Assignee: 3M Innovative Properties Company
  • Current Assignee Address: US MN St. Paul
  • Agent Dean M. Harts; Yen Tong Florczak
  • Priority: JP2004-025723 20040202
  • International Application: PCT/US2005/001269 WO 20050113
  • International Announcement: WO2005/076376 WO 20050818
  • Main IPC: H01L21/44
  • IPC: H01L21/44
Adhesive sheet for light-emitting diode device and light-emitting diode device
Abstract:
[Problem] To provide an adhesive sheet which is used for a light-emitting diode device, and which is free from cracks and peeling off of the adhered portions. [Means for Solving the Problem] An adhesive sheet for a light-emitting diode device, which comprises a thermoplastic polymer containing epoxy groups and a compound containing functional groups which are addition reactive with the epoxy groups or a polymerization catalyst which can effect a ring opening polymerization of the epoxy groups, and in which said thermoplastic polymer is cross-linked so that its flowability is restrained.
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