Invention Grant
- Patent Title: Semiconductor device comprising buried wiring layer
- Patent Title (中): 包括掩埋布线层的半导体器件
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Application No.: US11770337Application Date: 2007-06-28
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Publication No.: US07646062B2Publication Date: 2010-01-12
- Inventor: Yoshikazu Yamaoka , Satoru Shimada
- Applicant: Yoshikazu Yamaoka , Satoru Shimada
- Applicant Address: JP Osaka
- Assignee: Sanyo Electric Co., Ltd.
- Current Assignee: Sanyo Electric Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Ditthavong, Mori & Steiner, P.C.
- Priority: JP2006-179119 20060629; JP2007-141961 20070529
- Main IPC: H01L27/01
- IPC: H01L27/01 ; H01L27/12 ; H01L27/10 ; H01L29/73 ; H01L29/74 ; H01L27/148 ; H01L29/749 ; H01L29/768 ; H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119 ; H01L23/48 ; H01L23/52 ; H01L29/40

Abstract:
A semiconductor device that suppresses partial discharging to a semiconductor substrate caused by local concentration of current. The semiconductor device includes a semiconductor substrate, a gate electrode buried in the semiconductor substrate, a conductor buried in the semiconductor substrate further inward from the gate electrode, a wiring layer formed in the semiconductor substrate in connection with the conductor, and an insulation film arranged between the gate electrode and the conductor. The conductor is higher than the surface of the semiconductor substrate.
Public/Granted literature
- US20080001214A1 SEMICONDUCTOR DEVICE Public/Granted day:2008-01-03
Information query
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