Invention Grant
- Patent Title: Power semiconductor component with charge compensation structure and method for producing the same
- Patent Title (中): 具有电荷补偿结构的功率半导体元件及其制造方法
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Application No.: US11754742Application Date: 2007-05-29
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Publication No.: US07646061B2Publication Date: 2010-01-12
- Inventor: Franz Hirler
- Applicant: Franz Hirler
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Dicke, Billig & Czaja PLLC
- Priority: DE102006025218 20060529
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119

Abstract:
A power semiconductor device with charge compensation structure and a method for producing the same is disclosed. In one embodiment, the power semiconductor device has in a semiconductor body a drift path between a body zone and a substrate region. The drift path is divided into drift zones of a first conduction type. A field stop zone is provided having the first conduction type, which is arranged on the substrate region, wherein the net dopant concentration of the field stop zone is lower than that of the substrate region and higher than that of the drift zones.
Public/Granted literature
- US20070272953A1 POWER SEMICONDUCTOR COMPONENT WITH CHARGE COMPENSATION STRUCTURE AND METHOD FOR PRODUCING THE SAME Public/Granted day:2007-11-29
Information query
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