Invention Grant
- Patent Title: LED package methods and systems
- Patent Title (中): LED封装方法和系统
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Application No.: US11178214Application Date: 2005-07-08
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Publication No.: US07646029B2Publication Date: 2010-01-12
- Inventor: George G. Mueller , Kevin J. Dowling , Frederick M. Morgan , Ihor A. Lys
- Applicant: George G. Mueller , Kevin J. Dowling , Frederick M. Morgan , Ihor A. Lys
- Applicant Address: US MA Burlington
- Assignee: Philips Solid-State Lighting Solutions, Inc.
- Current Assignee: Philips Solid-State Lighting Solutions, Inc.
- Current Assignee Address: US MA Burlington
- Main IPC: H01L29/161
- IPC: H01L29/161
Abstract:
Methods and systems are provided for LED modules that include an LED die integrated in an LED package with a submount that includes an electronic component for controlling the light emitted by the LED die. The electronic component integrated in the submount may include drive hardware, a network interface, memory, a processor, a switch-mode power supply, a power facility, or another type of electronic component.
Public/Granted literature
- US20060022214A1 LED package methods and systems Public/Granted day:2006-02-02
Information query
IPC分类:
