Invention Grant
- Patent Title: Method for producing an integrated circuit having semiconductor zones with a steep doping profile
- Patent Title (中): 具有陡峭掺杂分布的半导体区的集成电路的制造方法
-
Application No.: US11675376Application Date: 2007-02-15
-
Publication No.: US07645690B2Publication Date: 2010-01-12
- Inventor: Markus Zundel , Hans-Joachim Schulze , Frank Hille
- Applicant: Markus Zundel , Hans-Joachim Schulze , Frank Hille
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102006007052 20060215
- Main IPC: H01L21/425
- IPC: H01L21/425

Abstract:
An integrated circuit and method, producing semiconductor zones with a steep doping profile is disclosed. In one embodiment, dopants are implanted in a region corresponding to the semiconductor zone to be formed and which has at least one topology process. During the subsequent laser irradiation for activating the dopants in the semiconductor zone, regions which are laterally directly adjacent to the semiconductor zone are protected against melting on account of the topology process.
Public/Granted literature
- US20080044988A1 METHOD FOR PRODUCING AN INTEGRATED CIRCUIT HAVING SEMICONDUCTOR ZONES WITH A STEEP DOPING PROFILE Public/Granted day:2008-02-21
Information query
IPC分类: