Invention Grant
- Patent Title: Plating resin molded article and process for producing the same
- Patent Title (中): 电镀树脂成型品及其制造方法
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Application No.: US10238909Application Date: 2002-09-10
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Publication No.: US07645370B2Publication Date: 2010-01-12
- Inventor: Toshihiro Tai , Ippei Tonosaki
- Applicant: Toshihiro Tai , Ippei Tonosaki
- Applicant Address: JP Tokyo
- Assignee: Daicel Polymer Ltd.
- Current Assignee: Daicel Polymer Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Flynn, Thiel, Boutell & Tanis, P.C.
- Priority: JP2001-274447 20010911; JP2001-363109 20011128; JP2002-100768 20020403
- Main IPC: C25D5/56
- IPC: C25D5/56 ; C23C18/52 ; C23C18/28 ; C23C18/30 ; C23C18/22 ; C23C18/24

Abstract:
The present invention is a plated resin molded article and process of producing the plated resin molded article, wherein metal plating is carried out on the surface of a thermoplastic resin molded article and either of requirements (1), (2) and (3) described below is included: (1) the thermoplastic resin molded article contains a thermoplastic resin and a water-soluble substance, a step of carrying out the removal of fat from the resin molded article and a step of electroless plating are provided in combination, and a step of etching by an acid containing a heavy metal is not included; (2) the thermoplastic resin molded article contains a polyamide-based resin and a styrene-based resin, a step of carrying out the removal of fat from the resin molded article and a step of electroless plating are provided in combination, and a step of etching by an acid containing a heavy metal is not included; or (3) a step of contact-treating the thermoplastic resin molded article with an acid or base not containing a heavy metal as the pre-treatment of the metal plating step is included.
Public/Granted literature
- US20030059621A1 Plating resin molded article and process for producing the same Public/Granted day:2003-03-27
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