Invention Grant
- Patent Title: Showerhead electrode assembly for plasma processing apparatuses
- Patent Title (中): 用于等离子体处理装置的喷头电极组件
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Application No.: US10743062Application Date: 2003-12-23
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Publication No.: US07645341B2Publication Date: 2010-01-12
- Inventor: William S. Kennedy , David E. Jacob
- Applicant: William S. Kennedy , David E. Jacob
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Buchanan Ingersoll & Rooney PC
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23C16/455 ; C23C16/50 ; H01L21/3065

Abstract:
A showerhead electrode assembly of a plasma processing apparatus includes a thermal control plate attached to a showerhead electrode, and a top plate attached to the thermal control plate. At least one thermal bridge is provided between opposed surfaces of the thermal control plate and the top plate to allow electrical and thermal conduction between the thermal control plate and top plate. A lubricating material between the thermal bridge and the top plate minimizes galling of opposed metal surfaces due to differential thermal expansion between the top plate and thermal control plate. A heater supported by the thermal control plate cooperates with the temperature controlled top plate to maintain the showerhead electrode at a desired temperature.
Public/Granted literature
- US20050133160A1 Showerhead electrode assembly for plasma processing apparatuses Public/Granted day:2005-06-23
Information query
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