Invention Grant
- Patent Title: Backlight module
- Patent Title (中): 背光模组
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Application No.: US12145028Application Date: 2008-06-24
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Publication No.: US07645152B2Publication Date: 2010-01-12
- Inventor: Chia-Chang Tsai
- Applicant: Chia-Chang Tsai
- Applicant Address: TW Hsinchu
- Assignee: AU Optronics Corp.
- Current Assignee: AU Optronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Thomas, Kayden, Horstemeyer & Risley
- Priority: TW97104530A 20080205
- Main IPC: H01R33/02
- IPC: H01R33/02

Abstract:
A lamp connection structure, configured to connect a lamp of a backlight module, is provided. The backlight module has a circuit board formed with a through-hole, which is defined by a side wall. The lamp connection structure comprises a clamping portion and an embedding portion. The clamping portion has a first end and a second end, and the first end is adapted to fix and to electrically connect to the lamp. The embedding portion has a first end and a second end. The first end is connected to the second end of the clamping portion while the second end of the embedding portion is inserted through the through-hole and contacting with the side wall.
Public/Granted literature
- US20090196055A1 Lamp Connection Structure Public/Granted day:2009-08-06
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