Invention Grant
- Patent Title: Liquid ejection method and liquid ejection apparatus
- Patent Title (中): 液体喷射方法和液体喷射装置
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Application No.: US11951200Application Date: 2007-12-05
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Publication No.: US07645016B2Publication Date: 2010-01-12
- Inventor: Akito Sato , Naoki Sudo
- Applicant: Akito Sato , Naoki Sudo
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Hogan & Hartson LLP
- Priority: JP2006-344841 20061221
- Main IPC: B41J29/393
- IPC: B41J29/393

Abstract:
A liquid ejection method includes: (A) moving nozzles relative to a medium, (B) ejecting liquid from the nozzles while the nozzles are moving relative to the medium, (C) forming a first pattern on the medium with the liquid ejected from the nozzles at either one of a timing delayed from a certain reference timing by a predetermined interval and a timing preceding the certain reference timing by a predetermined interval while the nozzles are moving in a certain direction with respect to the medium, and (D) when the first pattern has been formed on the medium with the liquid ejected from the nozzles at the timing delayed by the predetermined interval, forming a second pattern on the medium with the liquid ejected from the nozzles at a timing delayed from the certain reference timing by an interval equal to the predetermined interval while the nozzles are moving in a direction opposite to the certain direction with respect to the medium, and when the first pattern has been formed on the medium with the liquid ejected from the nozzles at the timing preceding by the predetermined interval, forming the second pattern on the medium with the liquid ejected from the nozzles at a timing preceding the certain reference timing by an interval equal to the predetermined interval while the nozzles are moving in the direction opposite to the certain direction with respect to the medium.
Public/Granted literature
- US20080150978A1 Liquid Ejection Method and Liquid Ejection Apparatus Public/Granted day:2008-06-26
Information query
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