Invention Grant
- Patent Title: Modular printed circuit board assembly for a pagewidth printer
- Patent Title (中): 用于页宽打印机的模块化印刷电路板组件
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Application No.: US11967226Application Date: 2007-12-30
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Publication No.: US07645005B2Publication Date: 2010-01-12
- Inventor: Kia Silverbrook , Norman Micheal Berry , Garry Raymond Jackson , Akira Nakazawa
- Applicant: Kia Silverbrook , Norman Micheal Berry , Garry Raymond Jackson , Akira Nakazawa
- Applicant Address: AU Balmain, New South Wales
- Assignee: Silverbrook Research Pty Ltd
- Current Assignee: Silverbrook Research Pty Ltd
- Current Assignee Address: AU Balmain, New South Wales
- Main IPC: B41J29/38
- IPC: B41J29/38

Abstract:
The invention provides for a printed circuit board (PCB) assembly for a pagewidth printer. The assembly includes a number of modular printhead controller PCBs each configured to control a respective modular printhead integrated circuit, and modular supports defining a raised portion and a recessed portion at an end thereof. Each PCB has electrical connecting strips which operatively overlie the respective recessed portions. The assembly also includes at least one connecting member for operatively connecting respective PCBs to each other, each connecting member having a series of parallel spaced conducting strips, said member shaped and configured for fitment into a cavity defined by the raised and recessed portions of two abutting supports to connect the connecting strips of two PCBs via said conducting strips.
Public/Granted literature
- US20080100668A1 Modular Printed Circuit Board Assembly For A Pagewidth Printer Public/Granted day:2008-05-01
Information query
IPC分类: