Invention Grant
- Patent Title: Rectangular substrate dividing apparatus
- Patent Title (中): 矩形基板分割装置
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Application No.: US11288285Application Date: 2005-11-29
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Publication No.: US07644747B2Publication Date: 2010-01-12
- Inventor: Satoshi Ohkawara , Kuniharu Izumi , Shigeru Ishii , Ryu Komine
- Applicant: Satoshi Ohkawara , Kuniharu Izumi , Shigeru Ishii , Ryu Komine
- Applicant Address: JP Tokyo
- Assignee: Disco Corporation
- Current Assignee: Disco Corporation
- Current Assignee Address: JP Tokyo
- Agency: Smith, Gambrell & Russell, LLP
- Priority: JP2004-346349 20041130
- Main IPC: H01L27/12
- IPC: H01L27/12

Abstract:
A rectangular substrate dividing apparatus, which can divide a rectangular substrate in a smaller space, accommodate devices, formed as individual pieces by the division, into device cases, and pick up the devices reliably and efficiently from a protective tape affixed to the back of the rectangular substrate, is provided. This apparatus separates a rectangular substrate, to whose back a protective tape is affixed and on which a plurality of devices are partitioned by a lattice of scheduled-separation lines, along the scheduled-separation lines to divide the rectangular substrate into the individual devices, and accommodates the devices in device cases. In a cutting-responsible region, the rectangular substrate is carried out of cassettes, cut by a cutter, and then cleaned by a cleaner. In a tape peeling-responsible region, the devices are picked up with the protective tape being peeled off. In a device accommodation-responsible region, the picked-up individual devices are accommodated into device cases.
Public/Granted literature
- US20060113595A1 Rectangular substrate dividing apparatus Public/Granted day:2006-06-01
Information query
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