A chip with an integrated circuit testing function includes a selecting unit positioned before a flip-flop of a scan chain, where the scan chain connects a scan-in pad, a scan-out pad and the flip-flop. When the chip is packaged and the scan-in pad does not connect to a pin of a package, the selecting unit selects a scan-in signal from another scan chain and transmits the scan-in signal from the another scan chain to the flip-flop; and when the chip is packaged and the scan-in pad connects to a pin of the package, the selecting unit selects a scan-in signal from the scan-in pad and transmits the scan-in signal from the scan-in pad to the flip-flop.