Invention Grant
- Patent Title: Logic soft error rate prediction and improvement
- Patent Title (中): 逻辑软错误率预测与改进
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Application No.: US11395119Application Date: 2006-03-31
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Publication No.: US07644311B2Publication Date: 2010-01-05
- Inventor: Chuen-Der Lien , Pao-Lu Louis Huang
- Applicant: Chuen-Der Lien , Pao-Lu Louis Huang
- Applicant Address: US CA San Jose
- Assignee: Integrated Device Technology, Inc.
- Current Assignee: Integrated Device Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Finnegan, et al.
- Main IPC: G06F11/00
- IPC: G06F11/00

Abstract:
A process and system for estimating the soft error rate of an integrated circuit. The process involves determining the surface area of and charge stored on each logic node on the integrated circuit. Then a response curve is used to estimate the soft error rate for a logic node using the charge stored on the logic node. Different response curves exist for integrated circuits of different technologies and products. Finally, the soft error rate of the integrated circuit can be estimated using the soft error rates for each logic node.
Public/Granted literature
- US20070234125A1 Logic soft error rate prediction and improvement Public/Granted day:2007-10-04
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