Invention Grant
- Patent Title: Buckling mechanism
- Patent Title (中): 屈曲机制
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Application No.: US11143668Application Date: 2005-06-03
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Publication No.: US07643854B2Publication Date: 2010-01-05
- Inventor: Kuo-Tai Wu
- Applicant: Kuo-Tai Wu
- Applicant Address: TW Hsinchu
- Assignee: Accton Technology Corporation
- Current Assignee: Accton Technology Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Bacon & Thomas, PLLC
- Priority: TW93117223A 20040615
- Main IPC: H04M1/00
- IPC: H04M1/00

Abstract:
A buckling mechanism used to fasten an electronic device such as a wireless broadband access point device or a wireless broadband router onto a bracket. The electronic device includes a top plate and a side plate having a side-plate aperture. The bracket is disposed on the top plate and has a bracket aperture. The buckling mechanism includes a first body portion, an embedding portion, a second body portion and a buckle portion. The embedding portion is disposed on one side of the first body portion to be embedded into the side-plate aperture. The second body portion is perpendicular and connected to another side of the first body portion, while the buckle portion is disposed on another side of the second body portion to be buckled with the bracket aperture.
Public/Granted literature
- US20050276011A1 Buckling mechanism Public/Granted day:2005-12-15
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