Invention Grant
- Patent Title: Semiconductor laser
- Patent Title (中): 半导体激光器
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Application No.: US11910930Application Date: 2006-03-15
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Publication No.: US07643527B2Publication Date: 2010-01-05
- Inventor: Kyosuke Kuramoto
- Applicant: Kyosuke Kuramoto
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Denki Kabushiki Kaisha
- Current Assignee: Mitsubishi Denki Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2005-115632 20050413
- International Application: PCT/JP2006/305097 WO 20060315
- International Announcement: WO2006/112228 WO 20061026
- Main IPC: H01S5/00
- IPC: H01S5/00

Abstract:
A semiconductor laser having a high electrostatic withstand voltage, resistant to a power supply surge, and having improved long-term reliability is obtained by reducing current leakage through a threading dislocation portion. The semiconductor laser includes a substrate having a high dislocation region having a dislocation density of 1×105 cm−2 or more, a crystalline semiconductor structure located on the substrate and having an active layer, an insulating film located on the semiconductor structure, a surface electrode located on the insulating film and electrically continuous with the semiconductor structure for injection of a current into the active layer, and a back electrode located on a rear surface of the substrate. The semiconductor laser has a laser resonator with a length L, and the area of the surface electrode is 120×L μm2 or less.
Public/Granted literature
- US20090022195A1 SEMICONDUCTOR LASER Public/Granted day:2009-01-22
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