Invention Grant
- Patent Title: Symmetric multiprocessing computer and star interconnection architecture and cooling system thereof
- Patent Title (中): 对称多处理计算机和星形互连架构及其冷却系统
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Application No.: US11877896Application Date: 2007-10-24
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Publication No.: US07643286B2Publication Date: 2010-01-05
- Inventor: Tomonori Hirai , Mario J. D. Lee , Jyh-Ming Jong
- Applicant: Tomonori Hirai , Mario J. D. Lee , Jyh-Ming Jong
- Applicant Address: TW Taoyuan
- Assignee: Mitac International Corp.
- Current Assignee: Mitac International Corp.
- Current Assignee Address: TW Taoyuan
- Agency: Quintero Law Office
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K5/00

Abstract:
A symmetric multiprocessor computer is provided with a star interconnection architecture and a cooling system. The star interconnection architecture include a middle plane, and plural first processor boards and second processor boards configured vertically onto opposite surfaces of the middle plane. The first processor boards and the second processor boards are crisscross to each other at the opposite surfaces of the middle plane. The cooling system includes a first cooling module and a second cooling system module configured for generating a plurality of first airflows and second airflows for the first processor boards and the second processor boards respectively, wherein the paths of the first airflows and the second airflows are crisscross to each other at the opposite surfaces of the middle plane.
Public/Granted literature
- US20090109610A1 Symmetric Multiprocessing Computer and Star Interconnection Architecture and Cooling System Thereof Public/Granted day:2009-04-30
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