Invention Grant
- Patent Title: Assembling structure for electronic module
- Patent Title (中): 电子模块组装结构
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Application No.: US11775387Application Date: 2007-07-10
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Publication No.: US07643280B2Publication Date: 2010-01-05
- Inventor: Chiang-Ko Chen
- Applicant: Chiang-Ko Chen
- Applicant Address: TW Taipei
- Assignee: First International Computer, Inc.
- Current Assignee: First International Computer, Inc.
- Current Assignee Address: TW Taipei
- Agency: Rabin & Berdo, P.C.
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
The assembling structure for electronic module comprise a case and a side frame, the characteristic is the case fixed on the base frame of the assembling structure by two front pivots and the case pivoted thereon. Besides, the side frame is installed adjacent to the case. In addition, the case and the side frame respectively include a plurality of locking holes, the side frame further including a locking controller with a first latch and a second latch corresponding to the locking holes, thereby locking the case at a horizontal and oblique position.
Public/Granted literature
- US20090016007A1 Assembling Structure for Electronic Module Public/Granted day:2009-01-15
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