Invention Grant
- Patent Title: Method of inspecting a semiconductor device and an apparatus thereof
- Patent Title (中): 检查半导体器件的方法及其装置
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Application No.: US12182438Application Date: 2008-07-30
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Publication No.: US07643138B2Publication Date: 2010-01-05
- Inventor: Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
- Applicant: Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Hitachi, Ltd.,Hitachi High-Technologies Corporation
- Current Assignee: Hitachi, Ltd.,Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2000-061836 20000302
- Main IPC: G01N21/00
- IPC: G01N21/00 ; G06K9/00

Abstract:
A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.
Public/Granted literature
- US20080291437A1 METHOD OF INSPECTING A SEMICONDUCTOR DEVICE AND AN APPARATUS THEREOF Public/Granted day:2008-11-27
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