An adapter frame is configured to receive a non-native test instrument module and is further configured for coupling within a test head of automatic semiconductor device test equipment. The adapter frame includes interfaces for operatively connecting the test instrument module to the test head using the existing slots of the test head. Interfaces may include mechanical interfaces, such as liquid cooling interfaces and other suitable interfaces. Additional software and/or hardware components may be included on the adapter frame to integrate the non-native test instrument module into the existing test equipment.