Invention Grant
- Patent Title: Test chip socket and method for testing a chip
- Patent Title (中): 测试芯片插座和芯片测试方法
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Application No.: US11841396Application Date: 2007-08-20
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Publication No.: US07642799B2Publication Date: 2010-01-05
- Inventor: Yoshihiro Ohkura
- Applicant: Yoshihiro Ohkura
- Applicant Address: JP Shizuoka-ken
- Assignee: Yamaha Corporation
- Current Assignee: Yamaha Corporation
- Current Assignee Address: JP Shizuoka-ken
- Agency: Dickstein Shapiro LLP
- Priority: JP2006-224650 20060821
- Main IPC: G01R31/26
- IPC: G01R31/26

Abstract:
A test chip socket comprises a contact block fixed to a tester substrate, a tray mounted to the contact block, the tray having a convex part for positioning test target chips to a plurality of mount positions, and a plurality of probes each of which is held by the contact block and contacts the tester substrate and the test target chip, wherein each probe contacts with a terminal of each test target chip mounted to the mounting position when the tray mounting the plurality of the test target chip is fixed to the contact block.
Public/Granted literature
- US20080054925A1 TEST CHIP SOCKET Public/Granted day:2008-03-06
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