Invention Grant
US07642720B2 Addressable microplasma devices and arrays with buried electrodes in ceramic
有权
可寻址微型器件和阵列,其中埋置电极在陶瓷中
- Patent Title: Addressable microplasma devices and arrays with buried electrodes in ceramic
- Patent Title (中): 可寻址微型器件和阵列,其中埋置电极在陶瓷中
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Application No.: US11337969Application Date: 2006-01-23
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Publication No.: US07642720B2Publication Date: 2010-01-05
- Inventor: J. Gary Eden , Sung-Jin Park
- Applicant: J. Gary Eden , Sung-Jin Park
- Applicant Address: US IL Urbana
- Assignee: The Board of Trustees of the University of Illinois
- Current Assignee: The Board of Trustees of the University of Illinois
- Current Assignee Address: US IL Urbana
- Agency: Greer, Burns & Crain, Ltd.
- Main IPC: H01J17/04
- IPC: H01J17/04 ; H01J17/49

Abstract:
An array of microcavity plasma devices is formed in a ceramic substrate that provides structure for and isolation of an array of microcavities that are defined in the ceramic substrate. The ceramic substrate isolates the microcavities from electrodes disposed within the ceramic substrate. The electrodes are disposed to ignite a discharge in microcavities in the array of microcavities upon application of a time-varying potential between the electrodes. Embodiments of the invention include electrode and microcavity arrangements that permit addressing of individual microcavities or groups of microcavities. The contour of the microcavity wall allows for the electric field within the microcavity to be shaped.
Public/Granted literature
- US20090295288A1 ADDRESSABLE MICROPLASMA DEVICES AND ARRAYS WITH BURIED ELECTRODES IN CERAMIC Public/Granted day:2009-12-03
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