Invention Grant
US07642711B2 Functional layer having wiring connected to electrode and barrier metal between electrode and wiring 失效
具有与电极和电极和布线之间的阻挡金属连接的布线的功能层

  • Patent Title: Functional layer having wiring connected to electrode and barrier metal between electrode and wiring
  • Patent Title (中): 具有与电极和电极和布线之间的阻挡金属连接的布线的功能层
  • Application No.: US11174474
    Application Date: 2005-07-06
  • Publication No.: US07642711B2
    Publication Date: 2010-01-05
  • Inventor: Yasushi Araki
  • Applicant: Yasushi Araki
  • Applicant Address: JP Tokyo
  • Assignee: FujiFilm Corporation
  • Current Assignee: FujiFilm Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Sughrue Mion, PLLC
  • Priority: JPP.2004-199825 20040706
  • Main IPC: H01J1/62
  • IPC: H01J1/62 H01J63/04
Functional layer having wiring connected to electrode and barrier metal between electrode and wiring
Abstract:
A functional device having very good operation durability characteristics, high reliability and satisfactory performance is provided. The functional device provided is a functional device having: at least one functional layer deposited over a substrate wherein an organic material is included; and a plurality of electrodes for bringing the functional layer into action. And this functional device is provided with wiring connected to each of the plurality of electrodes and a barrier metal made to lie between at least one among the plurality of electrodes and the wiring connected thereto.
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