Invention Grant
US07642711B2 Functional layer having wiring connected to electrode and barrier metal between electrode and wiring
失效
具有与电极和电极和布线之间的阻挡金属连接的布线的功能层
- Patent Title: Functional layer having wiring connected to electrode and barrier metal between electrode and wiring
- Patent Title (中): 具有与电极和电极和布线之间的阻挡金属连接的布线的功能层
-
Application No.: US11174474Application Date: 2005-07-06
-
Publication No.: US07642711B2Publication Date: 2010-01-05
- Inventor: Yasushi Araki
- Applicant: Yasushi Araki
- Applicant Address: JP Tokyo
- Assignee: FujiFilm Corporation
- Current Assignee: FujiFilm Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPP.2004-199825 20040706
- Main IPC: H01J1/62
- IPC: H01J1/62 ; H01J63/04

Abstract:
A functional device having very good operation durability characteristics, high reliability and satisfactory performance is provided. The functional device provided is a functional device having: at least one functional layer deposited over a substrate wherein an organic material is included; and a plurality of electrodes for bringing the functional layer into action. And this functional device is provided with wiring connected to each of the plurality of electrodes and a barrier metal made to lie between at least one among the plurality of electrodes and the wiring connected thereto.
Public/Granted literature
- US20060154034A1 Functional device Public/Granted day:2006-07-13
Information query