An electronic-component container is provided in which a metal lid is bonded with an insulating package. The container comprises the insulating package having a housing portion for housing an electronic component element having an electrical function, a metallized sealing portion formed around the housing portion and hermetically bonded with the metal lid, and a castellation having a terminal electrode formed at a side end portion thereof, and the metal lid formed in a shape as viewed from the top which is substantially equal to a shape as viewed from the top of the insulating package, wherein a brazing material is formed on a lower surface of the metal lid, and the brazing material is provided with a welding portion which is bonded with the metallized sealing portion inside the castellation when the metal lid is bonded with the insulating package.