Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11951816Application Date: 2007-12-06
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Publication No.: US07642662B2Publication Date: 2010-01-05
- Inventor: Takahiro Kasuga
- Applicant: Takahiro Kasuga
- Applicant Address: JP Nagano-shi
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2006-333998 20061212
- Main IPC: H01L23/544
- IPC: H01L23/544
Abstract:
A semiconductor device includes: solder balls provided on an upper package; and pads provided on a lower package and directly connected to the solder balls, wherein at least one of the pads serves as a fiducial mark. Further, a shape of at least one of the pads is different from that of other pads and an area of at least one of the pads is substantially equal to that of the other pads.
Public/Granted literature
- US20080258287A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2008-10-23
Information query
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