Invention Grant
- Patent Title: Liquid epoxy resin composition
- Patent Title (中): 液体环氧树脂组合物
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Application No.: US11601659Application Date: 2006-11-20
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Publication No.: US07642661B2Publication Date: 2010-01-05
- Inventor: Masatoshi Asano , Kaoru Katoh , Kazuaki Sumita
- Applicant: Masatoshi Asano , Kaoru Katoh , Kazuaki Sumita
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2005-336074 20051121; JP2006-304194 20061109
- Main IPC: H01L23/29
- IPC: H01L23/29 ; B32B27/04 ; B32B27/38 ; C08L63/00 ; C08L83/00
Abstract:
A liquid epoxy resin composition comprising:(A) a liquid epoxy resin;(B) an amine type curing agent;(C) a sulfur-containing phenol compound in an amount of from 1 to 20 parts by weight per total 100 parts by weight of the components (A) and (B); and(D) an inorganic filler in an amount of from 50 to 900 parts by weight per 100 parts by weight of the component (A).
Public/Granted literature
- US20070116962A1 Liquid epoxy resin composition Public/Granted day:2007-05-24
Information query
IPC分类:
