Invention Grant
- Patent Title: Support structure for low-k dielectrics
- Patent Title (中): 低k电介质的支撑结构
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Application No.: US10726474Application Date: 2003-12-01
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Publication No.: US07642649B2Publication Date: 2010-01-05
- Inventor: Masood Murtuza
- Applicant: Masood Murtuza
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Warren L. Franz; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L23/52
- IPC: H01L23/52

Abstract:
A semiconductor device employs a support structure to mitigate damage to dielectric layers having a low dielectric constant (k). The semiconductor device includes at least one inter-level dielectric layer (ILD) comprising a material having a low dielectric constant (k), and at least one support structure disposed within the low-k dielectric layer. The support structure mitigates damage of the semiconductor device by providing a mechanically stable interface between two layers in the semiconductor device.
Public/Granted literature
- US20050116345A1 Support structure for low-k dielectrics Public/Granted day:2005-06-02
Information query
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