Invention Grant
- Patent Title: Packaging for high power integrated circuits
- Patent Title (中): 大功率集成电路封装
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Application No.: US11720383Application Date: 2005-11-30
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Publication No.: US07642644B2Publication Date: 2010-01-05
- Inventor: Wendy L. Wilkins , Barry K. Gilbert , Bruce R. Kline
- Applicant: Wendy L. Wilkins , Barry K. Gilbert , Bruce R. Kline
- Applicant Address: US MN Rochester
- Assignee: Mayo Foundation for Medical Education and Research
- Current Assignee: Mayo Foundation for Medical Education and Research
- Current Assignee Address: US MN Rochester
- Agency: Quarles & Brady LLP
- International Application: PCT/US2005/043139 WO 20051130
- International Announcement: WO2006/060396 WO 20060608
- Main IPC: H01L23/46
- IPC: H01L23/46 ; H01L21/44
Abstract:
A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing devices and filled with a supercritical fluid that transports heat from the devices to a heat sink in thermal contact with the enclosure.
Public/Granted literature
- US20080093732A1 Packaging For High Power Integrated Circuits Using Supercritical Fluid Public/Granted day:2008-04-24
Information query
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