Invention Grant
US07642643B2 Apparatus for molding a semiconductor die package with enhanced thermal conductivity
有权
用于模制具有增强的导热性的半导体管芯封装的设备
- Patent Title: Apparatus for molding a semiconductor die package with enhanced thermal conductivity
- Patent Title (中): 用于模制具有增强的导热性的半导体管芯封装的设备
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Application No.: US11210632Application Date: 2005-08-24
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Publication No.: US07642643B2Publication Date: 2010-01-05
- Inventor: Frank L. Hall , Todd O. Bolken
- Applicant: Frank L. Hall , Todd O. Bolken
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
A method and apparatus for assembling and packaging semiconductor die assemblies utilizes a coating element such as a wafer back side laminate formed on a back side of a semiconductor die is disclosed. The coating element may be formed from a somewhat compressible and, optionally, resilient material, which seals against a surface of a mold cavity while the semiconductor die assembly is being encapsulated. In this manner, the coating element prevents encapsulant material from covering at least a portion of the back side of the semiconductor die to prevent encapsulant flashing over the back side and thus improve heat dissipation characteristics of the packaged semiconductor die during operation.
Public/Granted literature
- US20050280143A1 Apparatus for molding a semiconductor die package with enhanced thermal conductivity Public/Granted day:2005-12-22
Information query
IPC分类:
