Invention Grant
US07642637B2 Carrier for stacked type semiconductor device and method of fabricating the same 有权
层叠型半导体器件用载体及其制造方法

Carrier for stacked type semiconductor device and method of fabricating the same
Abstract:
A carrier for a stacked type semiconductor device includes a lower carrier having a first accommodating portion that accommodates a first semiconductor device, and an upper carrier having a second accommodating portion that accommodates a second semiconductor device stacked on the first semiconductor device so as to be placed in position on the first semiconductor device. It is thus possible to eliminate an additional device used for stacking the semiconductor device, and thereby reduce the cost.
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