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Invention Grant
US07642631B2 Packaged semiconductor chip comprising an integrated circuit chip ablated with laser and cut with saw blade from wafer 有权
封装的半导体芯片包括用激光烧蚀的集成电路芯片，并从晶片切割锯片

Packaged semiconductor chip comprising an integrated circuit chip ablated with laser and cut with saw blade from wafer
Abstract:
A packaged semiconductor chip comprising an integrated circuit chip including a low-k dielectric layer and a chip substrate, wherein an edge of the integrated circuit chip has a first edge portion and a second edge portion. At least part of the first edge portion being across a same level as the low-k dielectric layer, and the first edge portion having been laser ablated to have a series of rounded recesses formed therein. The second edge portion being across a same level as at least part of the chip substrate, and the second edge portion having a different surface texture than that of the first edge portion. The packaged semiconductor chip also comprises a packaging substrate having the integrated circuit chip attached and a plurality of solder bumps electrically connecting between the packaging substrate and the integrated circuit chip.
Abstract(Chinese):

一种封装半导体芯片，包括具有低k电介质层和芯片基板的集成电路芯片，其中所述集成电路芯片的边缘具有第一边缘部分和第二边缘部分。 所述第一边缘部分的至少一部分与所述低k电介质层相同，并且所述第一边缘部分被激光烧蚀以在其中形成一系列圆形凹陷。 所述第二边缘部分与所述芯片基板的至少一部分处于相同的高度，并且所述第二边缘部分具有与所述第一边缘部分不同的表面纹理。 封装的半导体芯片还包括具有附接的集成电路芯片的封装基板和电连接在封装基板和集成电路芯片之间的多个焊料凸块。

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