Invention Grant
US07642602B2 System and method for I/O ESD protection with polysilicon regions fabricated by processes for making core transistors
有权
用于制造核心晶体管的工艺制造的具有多晶硅区域的I / O ESD保护的系统和方法
- Patent Title: System and method for I/O ESD protection with polysilicon regions fabricated by processes for making core transistors
- Patent Title (中): 用于制造核心晶体管的工艺制造的具有多晶硅区域的I / O ESD保护的系统和方法
-
Application No.: US11550529Application Date: 2006-10-18
-
Publication No.: US07642602B2Publication Date: 2010-01-05
- Inventor: Ting Chieh Su , Min Chie Jeng , Chin Chang Liao , Jun Cheng Huang
- Applicant: Ting Chieh Su , Min Chie Jeng , Chin Chang Liao , Jun Cheng Huang
- Applicant Address: CN Shanghai
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
- Current Assignee Address: CN Shanghai
- Agency: Townsend and Townsend and Crew LLP
- Priority: CN200610027589 20060612
- Main IPC: H01L21/8238
- IPC: H01L21/8238

Abstract:
A system and method for electrostatic discharge protection. The system includes a first transistor coupled to a first system and including a first gate, a first dielectric layer located between the first gate and a first substrate, a first source, and a first drain. The first system includes or is coupled to a core transistor, and the core transistor includes a second gate, a second dielectric layer located between the second gate and a second substrate, a second source, and a second drain. The first transistor is selected from a plurality of transistors, and the plurality of transistors include a plurality of gate regions, a plurality of source regions, and a plurality of drain regions. Each of the plurality of gate regions intersects a polysilicon region.
Public/Granted literature
Information query
IPC分类: