Invention Grant
- Patent Title: Fin field effect transistors having capping insulation layers
- Patent Title (中): Fin场效应晶体管具有封盖绝缘层
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Application No.: US11433942Application Date: 2006-05-15
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Publication No.: US07642589B2Publication Date: 2010-01-05
- Inventor: Yong-Hoon Son , Si-Young Choi , Byeong-Chan Lee , Deok-Hyung Lee , In-Soo Jung
- Applicant: Yong-Hoon Son , Si-Young Choi , Byeong-Chan Lee , Deok-Hyung Lee , In-Soo Jung
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2003-0076960 20031031
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L29/76 ; H01L29/94

Abstract:
A field effect transistor includes a vertical fin-shaped semiconductor active region having an upper surface and a pair of opposing sidewalls on a substrate, and an insulated gate electrode on the upper surface and opposing sidewalls of the fin-shaped active region. The insulated gate electrode includes a capping gate insulation layer having a thickness sufficient to preclude formation of an inversion-layer channel along the upper surface of the fin-shaped active region when the transistor is disposed in a forward on-state mode of operation. Related fabrication methods are also discussed.
Public/Granted literature
- US20060202270A1 Fin field effect transistors having capping insulation layers Public/Granted day:2006-09-14
Information query
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