Invention Grant
- Patent Title: Electronic component assembly with composite material carrier
- Patent Title (中): 电子元件组装与复合材料载体
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Application No.: US12078672Application Date: 2008-04-03
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Publication No.: US07642564B2Publication Date: 2010-01-05
- Inventor: Chia-Liang Hsu , Chien-Fu Huang
- Applicant: Chia-Liang Hsu , Chien-Fu Huang
- Applicant Address: TW Hsinchu
- Assignee: Epistar Corporation
- Current Assignee: Epistar Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Bacon & Thomas, PLLC
- Priority: TW96112292A 20070404
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/00
Abstract:
The present invention relates to an electronic component assembly including a composite material carrier, a circuit carrier made of a dielectric material, a circuit with a conductive material formed on the circuit carrier, an intermediate layer between the circuit carrier and the composite material carrier, and an electronic component arranged on the composite material carrier and electrically connecting to the circuit.
Public/Granted literature
- US20080246052A1 Electronic component assembly with composite material carrier Public/Granted day:2008-10-09
Information query
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