Invention Grant
- Patent Title: Touch pad structure
- Patent Title (中): 触摸板结构
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Application No.: US11933663Application Date: 2007-11-01
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Publication No.: US07642479B2Publication Date: 2010-01-05
- Inventor: Jao-Ching Lin , Chung-Yi Shen , Lin-Abel Chu , Yen-Fu Liu
- Applicant: Jao-Ching Lin , Chung-Yi Shen , Lin-Abel Chu , Yen-Fu Liu
- Applicant Address: TW Taipei
- Assignee: Sentalic Corporation
- Current Assignee: Sentalic Corporation
- Current Assignee Address: TW Taipei
- Main IPC: H03K17/975
- IPC: H03K17/975

Abstract:
A touch pad includes a first substrate, a second substrate and a joining layer. The joining layer joins the first substrate and the second substrate together. The first substrate provides a refection layer at a lateral side or both sides thereof with at least a light emitting component being disposed at the periphery of said reflection layer. The second substrate provides an electrical circuit with a first conductor to connect with the light emitting component. The reflection layer is provided with a size less than said first substrate and has an upper side to adhere said first substrate so as to be fixed in said joining layer. the electrical circuit is capable of determining if the touch pad is touched with an object by means of receiving a change of coupling capacity of a sensing locus and capable of controlling luminosity of said light emitting component.
Public/Granted literature
- US20090114518A1 TOUCH PAD STRUCTURE Public/Granted day:2009-05-07
Information query
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