Invention Grant
- Patent Title: Enclosure for electrical receptacle
- Patent Title (中): 电气插座外壳
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Application No.: US12128263Application Date: 2008-05-28
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Publication No.: US07642458B2Publication Date: 2010-01-05
- Inventor: Darren J. Stockton
- Applicant: Darren J. Stockton
- Applicant Address: US CA City of Industry
- Assignee: Lincoln Global, Inc.
- Current Assignee: Lincoln Global, Inc.
- Current Assignee Address: US CA City of Industry
- Agency: Hahn Loeser + Parks LLP
- Agent Keith J. Marcinowski
- Main IPC: H01H13/04
- IPC: H01H13/04

Abstract:
An enclosure for an electrical receptacle includes walls having one or more recesses for receiving associated electrical conductors. The recesses may be covered by at least a first membrane enclosing the recess. The conductors may be manually inserted through the membrane wherein the membrane and/or the recess is self-sealing to automatically encapsulate the girth of the associated electrical conductors.
Public/Granted literature
- US20090294147A1 ENCLOSURE FOR ELECTRICAL RECEPTACLE Public/Granted day:2009-12-03
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