Invention Grant
- Patent Title: Electrical fuse structure and method
- Patent Title (中): 电熔丝结构及方法
-
Application No.: US12106759Application Date: 2008-04-21
-
Publication No.: US07642176B2Publication Date: 2010-01-05
- Inventor: Hsin-Li Cheng , Chia-Jung Lee , Chin-Shan Hou , Wei-Ming Chen
- Applicant: Hsin-Li Cheng , Chia-Jung Lee , Chin-Shan Hou , Wei-Ming Chen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/326
- IPC: H01L21/326 ; H01L21/479

Abstract:
An electrical fuse and a process of programming the same are presented. An electrical fuse comprises a lower level silicide layer on a non-doped or lightly-doped polysilicon layer, an upper level conductive layer, and a tungsten contact coupled between the lower level silicide layer and the upper level conductive layer. The tungsten contact and a neck portion of the silicide layer are the programmable portion of the electrical fuse. High post-programming resistance is achieved by a first programming phase that depletes silicide in the silicide layer, followed by a second programming phase that depletes tungsten in the tungsten contact.
Public/Granted literature
- US20090261450A1 Electrical Fuse Structure and Method Public/Granted day:2009-10-22
Information query
IPC分类: