Invention Grant
- Patent Title: Semiconductor memory device and method of production
- Patent Title (中): 半导体存储器件及其制造方法
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Application No.: US11241878Application Date: 2005-09-30
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Publication No.: US07642158B2Publication Date: 2010-01-05
- Inventor: Stefano Parascandola , Roman Knoefler , Stephan Riedel , Dominik Olligs , Torsten Mueller , Dirk Caspary
- Applicant: Stefano Parascandola , Roman Knoefler , Stephan Riedel , Dominik Olligs , Torsten Mueller , Dirk Caspary
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/94

Abstract:
The bit lines are produced by an implantation of a dopant by means of a sacrificial hard mask layer, which is later replaced with the gate electrodes formed of polysilicon in the memory cell array. Striplike areas of the memory cell array, which run transversely to the bit lines, are reserved by a blocking layer to be occupied by the bit line contacts. In these areas, the hard mask is used to form contact holes, which are self-aligned with the implanted buried bit lines. Between the blocked areas, the word lines are arranged normally to the bit lines.
Public/Granted literature
- US20070075381A1 Semiconductor memory device and method of production Public/Granted day:2007-04-05
Information query
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