Invention Grant
- Patent Title: Method for producing semiconductor device
- Patent Title (中): 半导体器件的制造方法
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Application No.: US11907401Application Date: 2007-10-11
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Publication No.: US07642149B2Publication Date: 2010-01-05
- Inventor: Tetsuya Hayashi , Masakatsu Hoshi , Hideaki Tanaka , Shigeharu Yamagami
- Applicant: Tetsuya Hayashi , Masakatsu Hoshi , Hideaki Tanaka , Shigeharu Yamagami
- Applicant Address: JP Yokohama-shi
- Assignee: Nissan Motor Co., Ltd.
- Current Assignee: Nissan Motor Co., Ltd.
- Current Assignee Address: JP Yokohama-shi
- Agency: Foley & Lardner LLP
- Priority: JP2006-282504 20061017; JP2007-158860 20070615
- Main IPC: H01L21/8238
- IPC: H01L21/8238

Abstract:
A method for producing a semiconductor device which includes: a semiconductor base, a hetero semiconductor region made of a semiconductor material different in band gap from a semiconductor material for the semiconductor base, and so configured as to form a hetero junction in combination with the semiconductor base, a gate insulating film so configured as to contact with the hetero junction between the semiconductor base and the hetero semiconductor region, a gate electrode so configured as to contact with the gate insulating film, a source electrode connected to the hetero semiconductor region, and a drain electrode connected to the semiconductor base. The method includes: forming the following in a self-aligning manner, by using a certain mask material: a source contact hole for the source electrode, and the gate electrode.
Public/Granted literature
- US20080108211A1 Method for producing semiconductor device Public/Granted day:2008-05-08
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