Invention Grant
- Patent Title: Ball-mounting method for coplanarity improvement in large package
- Patent Title (中): 大包装球面安装方法的共面性改善
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Application No.: US11648926Application Date: 2007-01-03
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Publication No.: US07642129B2Publication Date: 2010-01-05
- Inventor: Jimmy Liang , Gene Wu , Steven Hsu
- Applicant: Jimmy Liang , Gene Wu , Steven Hsu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of forming a packaging structure and the packages formed thereof are provided. The method includes providing a package having a top surface and placing solder balls on the top surface of the package. A coplanar surface is then placed against the solder balls, wherein the surface is non-adhesive. A reflow process is performed to the solder balls, so that top surfaces of the solder balls are substantially coplanar. The coplanar surface is then removed.
Public/Granted literature
- US20080160671A1 Ball-mounting method for coplanarity improvement in large package Public/Granted day:2008-07-03
Information query
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