Invention Grant
- Patent Title: Method of manufacturing circuits
- Patent Title (中): 制造电路的方法
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Application No.: US10491608Application Date: 2002-09-30
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Publication No.: US07642126B2Publication Date: 2010-01-05
- Inventor: Neil Kirby , John Jefferies
- Applicant: Neil Kirby , John Jefferies
- Applicant Address: GB Newport, Isle of Wight
- Assignee: Poly-Flex Circuits Limited
- Current Assignee: Poly-Flex Circuits Limited
- Current Assignee Address: GB Newport, Isle of Wight
- Agency: Weingarten, Schurgin, Gagnebin & Lebovici LLP
- Priority: GB0123676.9 20011002
- International Application: PCT/GB02/04397 WO 20020930
- International Announcement: WO03/030248 WO 20030410
- Main IPC: B23K26/20
- IPC: B23K26/20 ; B23K26/18 ; H05K3/32
Abstract:
The method uses a laser beam directed through the substrate to the conductive area of the substrate in order to bond the two together.
Public/Granted literature
- US20050121421A1 Method of manufacturing circuits Public/Granted day:2005-06-09
Information query
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