Invention Grant
US07642121B2 LED bonding structures and methods of fabricating LED bonding structures
有权
LED结合结构和制造LED结合结构的方法
- Patent Title: LED bonding structures and methods of fabricating LED bonding structures
- Patent Title (中): LED结合结构和制造LED结合结构的方法
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Application No.: US12268466Application Date: 2008-11-11
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Publication No.: US07642121B2Publication Date: 2010-01-05
- Inventor: David Beardsley Slater, Jr. , John Adam Edmond
- Applicant: David Beardsley Slater, Jr. , John Adam Edmond
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Summa, Additon & Ashe, P.A.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/28
Abstract:
A method is disclosed for fabricating an LED The method includes providing an LED chip having an epitaxial region comprising at least a p-type layer and an n-type layer, an ohmic contact formed on at least one of the p-type layer or the n-type layer, and a bond pad formed on the ohmic contact. The bond pad has a total volume less than about 3×10−5 mm3. The LED chip is bonded to a submount via thermocompression or thermosonic bonding.
Public/Granted literature
- US20090068774A1 LED Bonding Structures and Methods of Fabricating LED Bonding Structures Public/Granted day:2009-03-12
Information query
IPC分类:
