Invention Grant
US07642104B2 Method for contacting semiconductor components with a test contact
有权
用于将半导体部件与测试接点接触的方法
- Patent Title: Method for contacting semiconductor components with a test contact
- Patent Title (中): 用于将半导体部件与测试接点接触的方法
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Application No.: US11456122Application Date: 2006-07-07
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Publication No.: US07642104B2Publication Date: 2010-01-05
- Inventor: Horst Groeninger
- Applicant: Horst Groeninger
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Edell, Shapiro & Finnan, LLC
- Priority: DE102005032142 20050707
- Main IPC: H01L21/66
- IPC: H01L21/66 ; G01R31/26
Abstract:
A method for contacting an external contact area with a test contact is provided. The external contact area has a galvanically applied coating of a metal or a metal alloy. Before the contact is established between the external contact area and the test contact, the external contact area is wetted with a fluid including an inhibitor which contains an aliphatic hydrocarbon, a binder such as a white mineral oil and/or ethyl acetate, and a lubricant. The fluid lowers the contact resistance between the external contact area and the test contact.
Public/Granted literature
- US20070007514A1 Method for Contacting Semiconductor Components with a Test Contact Public/Granted day:2007-01-11
Information query
IPC分类:
