Invention Grant
- Patent Title: Method and system for yield and productivity improvements in semiconductor processing
- Patent Title (中): 半导体加工中产量和生产率提高的方法和系统
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Application No.: US11559781Application Date: 2006-11-14
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Publication No.: US07642100B2Publication Date: 2010-01-05
- Inventor: Chen-Hua Yu , Lawrance Sheu , Yi-Li Hsiao , Francis Ko
- Applicant: Chen-Hua Yu , Lawrance Sheu , Yi-Li Hsiao , Francis Ko
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: H01L21/66
- IPC: H01L21/66
Abstract:
A semiconductor processing method includes processing a first substrate while detecting at least one first processing parameter value in a first apparatus. The first processing parameter is analyzed, thereby yielding at least one first predicted parameter value. The first predicted parameter value is compared with a first pre-defined parameter value, thereby yielding at least one first comparison result. A first recipe is applied corresponding to the first comparison result for processing a second substrate in the first apparatus.
Public/Granted literature
- US20080064127A1 METHOD AND SYSTEM FOR YIELD AND PRODUCTIVITY IMPROVEMENTS IN SEMICONDUCTOR PROCESSING Public/Granted day:2008-03-13
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