Invention Grant
- Patent Title: Heat resistant masking tape
- Patent Title (中): 耐热胶带
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Application No.: US10561358Application Date: 2004-06-24
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Publication No.: US07641967B2Publication Date: 2010-01-05
- Inventor: Masaru Shinohara , Yoong Kim , Yorinobu Takamatsu , Harumi Ushito
- Applicant: Masaru Shinohara , Yoong Kim , Yorinobu Takamatsu , Harumi Ushito
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent James A. Baker; Dean M. Harts
- Priority: JP2003-206343 20030806
- International Application: PCT/US2004/020326 WO 20040624
- International Announcement: WO2005/017059 WO 20050224
- Main IPC: B32B27/30
- IPC: B32B27/30 ; B32B7/12 ; B32B27/04 ; B32B27/08 ; B32B27/36 ; B32B27/38 ; C08L33/00 ; C08L63/00

Abstract:
A heat resistant masking tape, comprising (1) a heat resistant backing film layer; and (2) a pressure-sensitive adhesive layer disposed on the heat resistant backing film layer, wherein the pressure-sensitive adhesive layer comprises a polymer resulting from polymerizing and cross-linking a monomer mixture comprising an alkyl (meth)acrylate with an alkyl group having 4 to 15 carbon atoms, glycidyl (meth)acrylate and (meth)acrylic acid, the glycidyl (meth)acrylate being present in an amount of 2 to 13% by weight of the total weight of monomers and the (meth)acrylic acid being present in an amount of 1 to 7% by weight of the total weight of monomers.
Public/Granted literature
- US20070104972A1 Heat resistant masking tape Public/Granted day:2007-05-10
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