Invention Grant
- Patent Title: In-mold transfer film
- Patent Title (中): 模内转印膜
-
Application No.: US11936974Application Date: 2007-11-08
-
Publication No.: US07641948B2Publication Date: 2010-01-05
- Inventor: Hiroshi Kobayashi , Mitsuo Hirano
- Applicant: Hiroshi Kobayashi , Mitsuo Hirano
- Applicant Address: JP Tokyo
- Assignee: Alps Electric Co., Ltd.
- Current Assignee: Alps Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Brinks Hofer Gilson & Lione
- Priority: JP2006-311663 20061117
- Main IPC: B41M5/40
- IPC: B41M5/40
Abstract:
An in-mold transfer film is formed to satisfy the conditions of F2>F1, F3>F2, F3>F1, and F3>F1+F4+F5, where F1 is an adhesive force at an interface between a base and a mold-release layer, F2 is an adhesive force at an interface between the mold-release layer and a printed ink layer, F3 is an adhesive force at an interface between the printed ink layer and a transferred object, F4 is a cohesive force of the mold-release layer, and F5 is a cohesive force of the printed ink layer.
Public/Granted literature
- US20080118715A1 IN-MOLD TRANSFER FILM Public/Granted day:2008-05-22
Information query
IPC分类:
