Invention Grant
- Patent Title: Method for forming gold plating
- Patent Title (中): 镀金方法
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Application No.: US10895498Application Date: 2004-07-21
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Publication No.: US07641944B2Publication Date: 2010-01-05
- Inventor: Masaya Ichimura , Kanji Masui
- Applicant: Masaya Ichimura , Kanji Masui
- Applicant Address: JP Aichi
- Assignee: Kabushiki Kaisha Tokai Rika Denki Seisakusho
- Current Assignee: Kabushiki Kaisha Tokai Rika Denki Seisakusho
- Current Assignee Address: JP Aichi
- Agency: Crompton, Seager & Tufte, LLC
- Priority: JP2003-280964 20030728; JP2004-210430 20040716
- Main IPC: B05D1/18
- IPC: B05D1/18 ; B05D3/06
Abstract:
A method for forming gold plating. The method includes preparing a solution containing gold ions and a reductant, immersing an object that is to be plated in the solution, irradiating the object with ultraviolet rays, and depositing gold on the object to form gold plating when the ultraviolet rays cause a photochemical reaction in the solution.
Public/Granted literature
- US20050023248A1 Method and apparatus for forming gold plating Public/Granted day:2005-02-03
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